Triple-axis Logosol Prealigners LPA Series

SKU
3-Achs Prealigner "Standalone"
Delivery Time
on request
  • For wafer sizes from 2'' up to 12''
  • Alignment cycle time < 2.5 seconds
  • Contactless measuring via LED and CCD senor
  • Transparent, semi-transparent, punched and opaque wafers alignable
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Andreas Möller

   Andreas Möller
     

Triple-axis Logosol Prealigners LPA Series

Description

The Logosol prealigners are innovative, high precision, class 1 compatible Logosol prealigner solutions with integrated scan electronics.
The Logosol prealigners are proprietary products of Logosol, Inc. USA www.logosolinc.com

Characteristics

  • innovative all-in-one design
  • alignment times < 3.5 seconds
  • repeatability: linear 0.025 mm, circular 0.02°
  • contactless measurement using LED and CCD sensor
  • integrated scanning electronics
  • standalone capability
  • chuck or pin load and change to another wafer size without rebuild
  • transparent, semi-transparent, holed and opaque wafers can be aligned
  • SEMI, flat and notch wafer specifications
  • for wafer sizes from 2" to 18"
  • connection fields available from the side and from below
  • option: external (notch sensor)
  • option: dual layer for bonded wafer

The information on this page is the sole property of Logosol, Inc. www.logosolinc.com

ROBOTIK Allgemein/Generally
pdf
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Last update 2024/03/08

Characteristics

Specifications

Prealigner model

Standalone

Embedded

Edge handling

26-3

38-3

58-3

312-3

812-3

1218-3

25-1E

38-1E

58-1E

312-1E

812-1E

1218-1E

Type

Wafer
diameter

2"

3"

100 mm

4EH, 45EH

125 mm

5EH, 45EH, 56EH

150 mm

6EH, 56EH

200 mm

8EH, 8ET

300 mm

12ET

450 mm

Square substrates

n/a

Angular accuracy
(3 sigma)

10 000 CPR encoder

0.04°

n/a

0.06°

n/a

0.04°

24 000 CPR encoder

0.02°

0.04°

0.02°

Centering accuracy
(3 sigma)

25 µm

50 µm

25 µm

Max initial offset

10 mm

12 mm

9 mm

10 mm

1.7 to 2.0 mm

Body
dimensions

W

173 mm

95 mm

173 mm

L

267 mm

317 mm

404 mm

266 mm

328 mm

267 or 317 mm

H

190 mm

191 mm

190 to 196 mm

Weight

5.0 to 5.7 kg

3.4 to 3.8 kg

5.3 to 6.0 kg

Servo axes

three

one

three

Handling

vacuum chuck and pins

vacuum chuck

edge handling

Facilities required

100-240VAC, 50-60 Hz, 48 V A or 24 V DC/2A, vacuum 12" Hg for vacuum retention

Host interface

RS232, Ethernet

Flat / Notch compatibility

SEMI standards compliant

Wafer opacity

transparent, semi-transparent and opaque

Cleanliness

class 1

MTBF

more than 70000 hours